Development and characterization of lead free solder alloy

Authors

  • Ravinder Singh Production and Industrial Engineering Department, PEC University of Technology Chd, India
  • Dr. N.M Suri Production and Industrial Engineering Department, PEC University of Technology Chd, India

Keywords:

Lead free solder, Sn-Ag solder, Optical microscopy, XRF, Micro hardness

Abstract

Tin- Lead (Sn-Pb) Solder was used widely in electronic industry in past few decades. But due to environment
and health concerns over the use of toxic lead, attached with strict legislation of the banned of Pb use in electronic
industry pulls the attention to development of new lead free solder. Present study aims to develop the lead free Sn-Ag
solder and examine its micro structural properties using optical microscope. To determine the elemental composition of
alloy XRF test has been done. The Vickers hardness test has also been done to determine the micro hardness of the alloy.

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Published

2016-05-25

How to Cite

Ravinder Singh, & Dr. N.M Suri. (2016). Development and characterization of lead free solder alloy. International Journal of Advance Research in Engineering, Science & Technology, 3(5), 914–917. Retrieved from https://ijarest.org/index.php/ijarest/article/view/751

Issue

Vol. 3 No. 5 (2016): Volume: 03, Issue: 05 - May, 2016.

Section

Articles