Thermal Analysis of Convex Pin Fin Heat Sink

Abstract

In Modern electronics thermal management face considerable challenges in the wake of component
efficiency which has led to higher demands on net heat dissipation. Due to that heat dissipation the electronic device
get damaged. The main aim of this paper is to their various cooling mechanisms having been continuously employed
to remove heat from heat sinks. Fins are used in a large number of applications to increase the heat transfer from
surfaces. Typically, the fin material has a high thermal conductivity. The fin is exposed to a flowing fluid, which
cools or heats it, with the high thermal conductivity allowing increased heat being conducted from the wall through
the fin. The design of fins is encountered in many situations and we thus examine heat transfer in a fin as a way of
defining some criteria for design. The preference of an optimal heat sink based on a number of geometric
parameters such as fin height, fin length, fin thickness, number of fins, base plate thickness, space between fins, fin
shape or profile, material etc. The fins are supported or maintained in a convex array by a structure. Heat
dissipation capability is augmented by forcing a cooling fluid such as air through the convex fins. In this project,
heat transfer coefficients may be used to determine by using ANSYS software. That code is used for the simulations
and analysis of convex pin fin heat sinks for electronics cooling is investigated. Based on the results obtained it can
be concluded that in the sense of junction temperature convex pin fins are efficient. These heat sink designs promises
to remain electronic circuits cooler than standard pin-fin heat sinks. It is also found that total weight of the system
may be reduced considerably with the use of advanced materials relative to most commonly used heat sink materials
at the same thermal performance.